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论文类型：会议论文

发表时间：2014-08-31

收录刊物：EI、Scopus

卷号：645-646

页面范围：853-858

摘要：An optimization method for fabricating 3D microneedle arrays with larger cone angles through backside exposure is demonstrated in this paper. A photo mask was designed to fabricate SU-8 microneedle based on diffraction of UV light. A circular hole diffraction was simulated with Matlab to obtain light intensity distribution. The simulation results show that the cone angles and surface profile can be adjusted by changing the thickness of substrate and exposure dose. Based on the simulation results, the microneedles with heights of 265   m to 380   m and cone angles in the range of 5.1   to 15.6   were fabricated by the backside exposure technology through one time UV lithography. Compared with previous approaches, the fabrication process in this paper takes advantages of simple, low cost and mass production. ? (2015) Trans Tech Publications, Switzerland.