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论文类型：会议论文

发表时间：2018-01-01

收录刊物：CPCI-S

页面范围：243-249

关键字：SU-8; Inertial switch; Ultra-high aspect ratio

摘要：SU-8 photoresist and electroforming based UV-LIGA process is an effective way to fabricate inertial switches. However, during the fabrication, the high stress in the SU-8 layers often causes them to detach from the substrate. To solve the detachment problem of SU-8 layers, a novel method was presented in this paper to release the internal stress in SU-8 layers by decreasing the area of electroforming layers. By using this method, a multi-scale inertial switch with ultra-high aspect ratio 17: 1 was fabricated successfully. The overall size of the inertial switch is 14x11x0.6mm. The method presented in this paper can provide help to the fabrication of micro metal devices with large area and high aspect ratio.