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发表时间：2022-10-10

发表刊物：电加工与模具

期号：2

页面范围：40-44

ISSN号：1009-279X

摘要：In order to meet the continue demands for fuse switch in military weapon system ,a switch with high aspect ratio structure was fabricated on a metal substrate by using the processes of lithography and precision micro electroforming. The effects of ultrasonic assisted development and exposure measurement on film fabrication were studied. The difficulties in making high aspect ratio film were overcame. To solve the problem of interface bonding failure ,the components of electroforming solution were improved and the molds were pretreated. At the same time ,the fabrication error caused by swelling and release was reduced by the introduction method of size error compensation. The overall size of the switch is 4000 μm ×3900 μm ×360 μm,the minimum size is 20 μm while the maximum depth width ratio is 14:1. This research provides a feasible reference for the fabrication of high aspect ratio structure.

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