点击次数：

发表时间：2022-10-09

发表刊物：纳米技术与精密工程

所属单位：机械工程学院

期号：1

页面范围：36-40

ISSN号：1672-6030

摘要：Based on the no back plate growing technology, with SU-8 film as sacrificial layer, a kind of three dimensional movable micro-mechanism was fabricated directly on mental substrate. The key fabricating technologies mainly involve optical lithography of SU-8 thick photoresist technology, high-aspect-ratio structure micro-electroforming technology, and sacrificial layer technology. This paper discussed poor adhesive property between SU-8 film and metal substrate, bubbles in SU-8 film, problem of hard removal of SU-8 photoresist and low adhesion strength between substrate and electroforming layer or between the first electroformed layer and the second one. Adhesion promoter layer technology, technology of step by step increase in temperature, and strict pickling technology were employed to solve the problems in the process. In the process of fabricating metal microstructure direct on metal substrate by microelectroforming technology, the substrate could be used as a part of the final structure. This method has many advantages, such as saving fabricating time, reducing growing internal stress, improving strength and reliability of the final structure. Electroforming time decreased from several days even several weeks to several hours and the deformation caused by internal stress was eliminated in the process.

备注：新增回溯数据