Hits:
First Author:pan shengshan
Disigner of the Invention:wangqian,范海东,zhangzhe,gengtiesuo,tanyanbin,qiuwenliang,huangcailiang
Application Number:CN201510034125.0
Authorization Date:2015-01-21
Authorization number:CN104631316A
Pre One:一种形状记忆合金的低温冷拉装置
Next One:一种采用轻质混凝土的桥面补强铺装层
