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Indexed by:期刊论文

Date of Publication:2012-04-01

Journal:MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Included Journals:SCIE、EI、Scopus

Volume:18

Issue:4

Page Number:481-488

ISSN No.:0946-7076

Abstract:A flexible microfluidic chip is difficult to fabricate using the standard hot embossing technology. In this study, rubber-assisted embossing of polymer thin films using molds with through-thickness microchannels was investigated. The polymer film was thermoformed into the microchannels by rubber as a soft counter-tool. Different processing conditions, as well as material selections, affecting the thickness uniformity and replicated depth were examined. Results indicated that smoother surfaces on the embossed articles were created, and the thickness uniformity and the depth of the embossed channel were significantly affected by the embossing temperature, the embossing pressure, and the rubber hardness. The embossed film was sealed on one side with a layer of transparent adhesive film to form closed microchannels, and desired 3-D flow characteristics were obtained with this flexible microfluidic chip.