Current position: Home >> Scientific Research >> Paper Publications

Deposition of Ti-Si-N films on Al substrates by magnetron sputtering

Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2013-11-01

Journal: SURFACE ENGINEERING

Included Journals: Scopus、EI、SCIE

Volume: 29

Issue: 10

Page Number: 749-754

ISSN: 0267-0844

Key Words: Ti-Si-N; Nanocomposite; Hardness; Adhesion

Abstract: The objective of this work is to settle the problem of adhesion between hard films and soft metal substrates. Hard Ti-Si-N films were deposited onto soft Al substrates with a double target magnetron sputtering system. The composition, structure, surface morphologies and mechanical properties were characterised by electron probe microanalyser, X-ray diffraction, atomic force microscope, scratch test and nanoindentation respectively. The as-deposited films had good adhesion to the Al substrates and had a smooth and lustrous surface. The maximum hardness of the films achieved was as high as 27.2 GPa at the Si target power of 80 W.

Prev One:Effect of deposition pressure on mechanical properties of Al-Mg-B thin films

Next One:Low temperature synthesis of GaN films on ITO substrates by ECR-PEMOCVD