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一种LED器件的硅基板与铜微热管集成制造方法

Release Time:2022-10-19  Hits:

First Author: 罗怡

Disigner of the Invention: 王晓东,liugang,邹靓靓,王立鼎

Institution: 机械工程学院

Application Number: CN102820405A

Authorization Number: CN201210246473.0

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