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一种LED封装用含硅环氧树脂组合物及其制备方法

Release Time:2019-03-09  Hits:

First Author: 王忠刚

Disigner of the Invention: 刘万双

Application Number: CN201110062716.0

Authorization Date: 2011-03-16

Authorization Number: CN102199276A

Prev One:一种含硅芳香氰酸酯单体及其制备方法
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