Current position: Home >> Scientific Research >> Patents

一种LED封装用含硅环氧树脂组合物及其制备方法

Release Time:2022-10-20  Hits:

First Author: 王忠刚

Disigner of the Invention: 刘万双

Institution: 化工学院

Application Number: CN102199276A

Authorization Number: CN201110062716.0

Prev One:一种纳米级荧光聚合物稀土配位物微球的制备方法

Next One:一种纳米级荧光聚合物稀土配位物微球的制备方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep