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Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers

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Date of Publication:2022-10-02

Journal:Rare Metals

Volume:30

Issue:4

Page Number:381-386

ISSN No.:1001-0521

Pre One:Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

Next One:Effects of hole-perpendicularity error on joint stiffness of single-lap double-bolt composite joints
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