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Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

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Date of Publication:2022-10-02

Journal:MATERIALS AND MANUFACTURING PROCESSES

Volume:25

Issue:6

Page Number:412-417

ISSN No.:1042-6914

Pre One:Effect of Fiber Directions on the Surface Quality of Milling C/SiC Composites

Next One:Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers
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