Current position: Home >> Scientific Research >> Patents

集成厚度可控绝缘层的非接触电导检测微芯片制作方法

Release Time:2019-03-09  Hits:

First Author: 刘军山

Disigner of the Invention: 王立鼎,杜立群,徐征,Chong Liu,徐飞

Application Number: CN201210132614.6

Authorization Date: 2012-05-02

Authorization Number: CN102641759A

Prev One:一种热塑性聚合物多层微流控芯片封合方法

Next One:基于微流控技术的两步构建三维神经干细胞模型的方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep