集成厚度可控绝缘层的非接触电导检测微芯片制作方法
Release Time:2019-03-09 Hits:
First Author:刘军山
Disigner of the Invention:王立鼎,杜立群,徐征,Chong Liu,徐飞
Application Number:CN201210132614.6
Authorization Date:2012-05-02
Authorization Number:CN102641759A
Release Time:2019-03-09 Hits:
First Author:刘军山
Disigner of the Invention:王立鼎,杜立群,徐征,Chong Liu,徐飞
Application Number:CN201210132614.6
Authorization Date:2012-05-02
Authorization Number:CN102641759A