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一种热塑性聚合物多层微流控芯片封合方法

Release Time:2019-03-09  Hits:

First Author: Chong Liu

Disigner of the Invention: 丁喜平,刘军山,徐征,李经民

Application Number: CN201010152285.2

Authorization Date: 2010-04-21

Authorization Number: CN101823686A

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