yRlBd2h8IRkGlLKEQxjRbBxAx8NtdlDlICRo2jrcXvunmhPWzZzu2V5bbzVL
Current position: Home >> Scientific Research >> Patents

一种电热驱动微结构的制作方法

Release Time:2019-03-09  Hits:

First Author:杜立群

Disigner of the Invention:徐征,刘军山,Chong Liu,李永辉,贾胜芳

Application Number:CN201010149262.6

Authorization Date:2010-04-16

Authorization Number:CN101814866A

Prev One:一种提高微电铸器件尺寸精度的超声处理方法

Next One:一种热塑性聚合物多层微流控芯片封合方法