location: Current position: Home >> Scientific Research >> Paper Publications

AlN陶瓷基板材料热导率与烧结助剂的研究进展

Hits:

Date of Publication:2009-01-01

Journal:材料导报

Affiliation of Author(s):材料科学与工程学院

Volume:23

Issue:9

Page Number:56-62

Pre One:Fabrication of aluminum nitride (AlN) hollow fibers by carbothermal

Next One:电子束熔炼时间对多晶硅杂质去除效果研究