Hits:

Date of Publication:2012-01-01

Journal:功能材料

Affiliation of Author(s):材料科学与工程学院

Issue:11

Page Number:1479-1481,1485

ISSN No.:1001-9731

Abstract:HF acid etching sedimentation process was designed to recycling of silicon from cutting slurry waste in poly-silicon slicing process.The effects of several operational variables on the recovery rate and yield of silicon kerfs were systematically investigated,including HF acid concentration,HF processing time.Also the effects of dispersion time of ultrasonic agitation prior to the HF acid etching sedimentation process were also studied.In considering the acceptable levels of both recovery rate and yield,a product with Si recovery rate of 82wt% and the yield 62% is obtained under the operating conditions by setting HF acid concentration at 2%,HF processing time at 24h,the agitation time at 60min.It is indicated that through this method we can recycle the Si powder from slurry waste.

Note:新增回溯数据