location： Current position: Home >> Scientific Research >> Paper Publications

Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting

Hits:

Date of Publication:2022-10-03

Journal:INTERNATIONAL JOURNAL OF THERMAL SCIENCES

Volume:74

Issue:C

Page Number:37-43

ISSN No.:1290-0729

Pre One:Thickness Controlled Water Vapors Assisted Growth of Multilayer Graphene by Ambient Pressure Chemical Vapor Deposition

Next One:THERMODYNAMICS ON BORON REJECTION DURING METALLURGICAL GRADE SILICON OXIDATION BY SILICON DIOXIDE
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep