Release Time:2019-03-09 Hits:
First Author: 姜大川
Disigner of the Invention: Jason Jieshan Qiu,Yi Tan,石爽,任世强
Application Number: CN201310209897.4
Authorization Date: 2013-05-31
Authorization Number: CN103266349A
Prev One:一种电子束熔炼制备镍基高温合金的方法
Next One:多晶硅铸锭硅真空固液分离方法及分离设备