Hits:
First Author:Yi Tan
Disigner of the Invention:jiangdachuan,shishuang,温书涛,邹瑞洵
Affilication of Author(s):材料科学与工程学院
Application Number:CN103086379A
Authorization number:CN201310023866.X
Pre One:多晶硅铸锭硅真空固液分离方法及分离设备
Next One:一种电子束熔炼制备镍基高温合金的方法