Release Time:2019-03-09 Hits:
First Author: 董闯
Disigner of the Invention: 王清,王英敏,羌建兵
Application Number: CN200410020899.X
Authorization Date: 2004-07-02
Authorization Number: CN1594639
Prev One:一种低Nb含量的生物医用b-钛合金
Next One:Co基Co-Si-B-Nb块体非晶合金