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低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺

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First Author:lixiaona

Disigner of the Invention:张心怡,朱瑾,wangqing,dongchuang

Authorization number:ZL 201080067138.3

Pre One:基于Fe-B-Y团簇的Fe基块体非晶合金

Next One:Thin Film of Copper-Nickel-Molybdenum Alloy and Method for Manufacturing the Same.
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