Release Time:2019-10-19 Hits:
First Author: 王清
Disigner of the Invention: 郝家苗,董闯,Zhang Qingyu,马跃
Application Number: CN201811096940.X
Authorization Date: 2018-09-20
Authorization Number: CN109023005A
Prev One:一种具有立方形态纳米粒子共格析出的BCC基高强高熵高温合金
Next One:一种基于团簇加连接原子模型的Co‑Al‑W基高温合金