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The effect of soft bake on adhesion property between SU-8 photoresist and Ni substrate by molecular dynamics simulation

Release Time:2022-10-06  Hits:

Date of Publication: 2022-10-03

Journal: JOURNAL OF APPLIED POLYMER SCIENCE

Volume: 127

Issue: 6

Page Number: 4456-4462

ISSN: 0021-8995

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