Release Time:2019-03-09  Hits:

Indexed by: Journal Article

Date of Publication: 2012-11-01

Journal: JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Included Journals: Scopus、EI、SCIE

Volume: 212

Issue: 11

Page Number: 2315-2320

ISSN: 0924-0136

Key Words: Multilayer microfluidic chip; Embedded sacrificial layer; Laser edge welding; PMMA

Abstract: "Reservoir unsealed" and "boundary layer separation" are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems. (C) 2012 Elsevier B.V. All rights reserved.