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一种热塑性聚合物多层微流控芯片封合方法

Release Time:2022-10-20  Hits:

First Author: Chong Liu

Disigner of the Invention: 李经民,徐征,刘军山,丁喜平

Institution: 机械工程学院

Application Number: CN101823686A

Authorization Number: CN201010152285.2

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