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    • 性别:男
    • 毕业院校:大连理工大学
    • 学位:博士
    • 所在单位:机械工程学院
    • 学科:机械电子工程. 精密仪器及机械
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    Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application

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      发布时间:2019-11-04

      论文类型:期刊论文

      发表时间:2020-01-01

      发表刊物:MATERIALS CHEMISTRY AND PHYSICS

      收录刊物:SCIE、EI

      卷号:239

      ISSN号:0254-0584

      关键字:Thickness uniformity; Megasonic agitation; Throwing power; Electrolyte conductivity; Cathodic polarizability

      摘要:Throwing power can be used to quantitatively characterize the uniform distribution ability of electroforming layer thickness. Prom the perspective of throwing power, the effect of megasonic agitation on improving the thickness uniformity was studied under the experiment system of nickel containing electrolyte. Firstly, throwing power experiments were performed with different megasonic power densities. Experiment results show that throwing power increases with the increase in power density. When power density is 2.4 W/cm(2), throwing power has a maximum value of 37.1% and increases 50.2% compared with the value of 24.7% obtained without megasonic. Then, the effect factors of throwing power, including electrolyte conductivity and cathodic polarizability, were investigated. The results reveal that megasonic has little effect on the cathodic polarizability, but it can increase the conductivity, which is conducive to improving thickness uniformity. Finally, to prove the feasibility of this method on micro metal devices, metal microfluidic chip molds were fabricated by megasonic micro electroforming. The result indicates that the thickness uniformity of the electroformed micro mold is improved by 43.4%.