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Indexed by:期刊论文

Date of Publication:2009-01-01

Journal:CIRP ANNALS-MANUFACTURING TECHNOLOGY

Included Journals:SCIE、EI

Volume:58

Issue:1

Page Number:213-216

ISSN No.:0007-8506

Key Words:Micromachining; EDM; High aspect ratio micro-hole

Abstract:When a micro-hole is drilled deeply by EDM, the viscous resistance in the narrow discharge gap causes difficulty in the removal of debris and bubbles from the working area, leading to frequent occurrences of abnormal discharges and resulting in extensive electrode wear. This paper presents a new method of drilling high aspect ratio micro-holes by EDM, in which the planetary movement of an electrode, with enhancement from ultrasonic vibration, provides an unevenly distributed gap for the debris and bubbles to escape from the discharge zone easily. Micro-holes with aspect ratio of 29 have been drilled. (C) 2009 CIRP.