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基于芯片制造的超薄硅片晶圆超窄缝切割关键技术

Release Time:2016-08-09  Hits:

Leading Scientist: 张振宇

Project Source: 地市厅局(含县)项目

Status: 结题

Supported by: Dalian City Science and Technology Bureau

Nature of Project: 纵向

Project Approval Number: 2009A18GX014

Date of Project Approval: 2009-01-01

Scheduled Completion Time: 2011-12-31

Date of Project Initiation: 2010-01-01

Date of Project Completion: 2023-09-13

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