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Indexed by:期刊论文

Date of Publication:2018-01-01

Journal:RSC ADVANCES

Included Journals:SCIE、EI

Volume:8

Issue:22

Page Number:12337-12343

ISSN No.:2046-2069

Abstract:Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied. The experimental results demonstrate that the epoxy resins filled by tetrapod-shaped ZnO (T-ZnO) whiskers have the superior thermal transport property in comparison to ZnO micron particles (ZnO MPs). The thermal conductivity of ZnO/epoxy and T-ZnO/epoxy composites in different mass fraction (10, 20, 30, 40, 50 wt%) are respectively investigated and the suitable models are compared to explain the enhancement effect of thermal conductivity. The thermal conductivity of TZnO/epoxy composites with 50 wt% filler reaches 4.38 W m(-1) K-1, approximately 1816% enhancement as compared to neat epoxy. In contrast, the same mass fraction of ZnO MPs are incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is because T-ZnO whiskers act as a thermal conductance bridge in the epoxy matrix. In addition, the other thermal properties of T-ZnO/epoxy composites are also improved. Furthermore, the T-ZnO/epoxy composite also presents a much reduced coefficient of thermal expansion (similar to 28.1 ppm K-1) and increased glass transition temperature (215.7 degrees C). This strategy meets the requirement for the rapid development of advanced electronic packaging.