Release Time:2019-05-10 Hits:
First Author: 张振宇
Disigner of the Invention: Dongming Guo,陈雷雷,崔俊峰
Application Number: CN201711094048.3
Authorization Date: 2017-11-09
Authorization Number: CN107991181A
Prev One:一种碳化硅单晶纳米线拉断后的自愈合方法
Next One:一种II-VI族软脆晶体研磨抛光方法