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论文类型：期刊论文

发表时间：2011-01-01

发表刊物：INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

收录刊物：SCIE、EI

卷号：51

期号：1

页面范围：18-24

ISSN号：0890-6955

关键字：Silicon wafer; Surface finish; Subsurface damage; Grinding

摘要：An ultrafine diamond wheel of a mesh size of 12,000 was fabricated by using a hybrid bond material, which consists of silicon carbide, silica and alumina. The employment of the newly developed wheel enabled excellent performance during grinding of silicon wafers. An extremely smooth surface of an average roughness of 0.6 nm was achieved. TEM examinations showed that the total thickness of the defected layer was less than 60 nm. (C) 2010 Elsevier Ltd. All rights reserved.