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论文类型：期刊论文

发表时间：2010-04-01

发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI、Scopus

卷号：47

期号：9-12,SI

页面范围：1105-1112

ISSN号：0268-3768

关键字：Chemical mechanical polishing; Nanoscale machinability; Subsurface damage; Soft-brittle crystal; CdZnTe

摘要：Nanoscale machinability and subsurface damage induced by chemical mechanical polishing of three kinds of single crystals were investigated by nanoscratch and high-resolution transmission electron microscope (HRTEM). When the constant loads increase from 800 mu N to 3,200 mu N, the friction coefficient adjacently linearly increases from 0.199 to 0.292, due to the surface machining hardening effect. As the slight wiping on the surface of Cd(0.9)Zn(0.1)Te (111) leads to microscratches, the surface turns worse, resulting in the decrease and fluctuation of friction coefficient. Shear band appears on the surface of Cd(0.96)Zn(0.04)Te (111), while it disappears on the surfaces of Cd(0.96)Zn(0.04)Te (110) and Cd(0.9)Zn(0.1)Te (111), replacing with more obvious plastic flow pile-up, and showing the better nanoscale machinability. The cross-sectional HRTEM images show that after CMP the damage layer is 2 nm, and only consists of amorphous state, indicating the main material removal mode of chemical dissolving. While after lapping and mechanical polishing, wear track with width of about 50 nm is still left on the machined surface, and subsurface damage layer is about 10 nm.