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论文类型：期刊论文

发表时间：2009-04-01

发表刊物：MATERIALS AND MANUFACTURING PROCESSES

收录刊物：SCIE、EI

卷号：24

期号：4

页面范围：504-508

ISSN号：1042-6914

关键字：AFM; Al2O3 powder; Berkovich indenter; CdZnTe; Chemical mechanical polishing; Cutting speed; In-situ scanning; Lapping; Nanocutting; Nanoindenter; Nanosphere; Polishing slurry; SiO2; Soft brittle materials; TEM

摘要：(111), (110) Cd0.96Zn0.04Te, and (111) Cd0.9Zn0.1Te single crystals were lapped and polished by Al2O3 powder and SiO2 nanosphere, respectively. The ultrasmooth and damage-free surface with Ra of 1.96nm is achieved. The nanocutting process was conducted by a Berkovich indenter. When a cutting speed is 10m/s and applied load is 10N, the surface roughness Ra of (111) Cd0.96Zn0.04Te is 0.22nm. The results show that lapping, chemical mechanical polishing, and nanocutting composite process is suitable for the machining of soft brittle materials.