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Indexed by:期刊论文

Date of Publication:2016-04-01

Journal:MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

Included Journals:SCIE、EI、Scopus

Volume:22

Issue:4

Page Number:721-726

ISSN No.:0946-7076

Abstract:The chamber is an important part of the inkjet printhead. However, the present fabrication methods of chamber suffer from a low alignment resolution between nozzle plates and piezoelectric structure and residual SU-8 removing problems during chamber fabricating process. In this paper, a SU-8 chamber was fabricated by using ultraviolet (UV) photolithography and SU-8 thermal bonding method. By this method, the infilling problem of the chamber during thermal bonding process was solved, and low alignment resolution problem of conventional UV exposure system during assembly process was avoided. The thickness of the SU-8 nozzle plate was optimized, and the influence of bonding parameters on the deformation of chamber was analyzed. The simulation results show that the optimal thickness of the SU-8 nozzle plate is 40 mu m and the optimal bonding parameters are bonding temperature of 50 A degrees C, bonding pressure of 160 kPa and bonding time of 6 min. The tensile test results show the bonding strength of the SU-8 chamber is 2.1 MPa by using the optimized bonding parameter.