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Indexed by:Journal Papers

Date of Publication:2015-08-01

Journal:JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Included Journals:SCIE、EI、Scopus

Volume:25

Issue:8

ISSN No.:0960-1317

Key Words:1D nanofluidic chip; O-2 plasma; ethanol; PET; thermal bonding

Abstract:Plastic planar nanofluidic chips are becoming increasingly important for biological and chemical applications. However, the majority of the present bonding methods for planar nanofluidic chips suffer from high dimension loss and low bonding strength. In this work, a novel thermal bonding technique based on O-2 plasma and ethanol treatment was proposed. With the assistance of O-2 plasma and ethanol, the PET (polyethylene terephthalate) planar nanofluidic chip can be bonded at a low bonding temperature of 50 degrees C. To increase the bonding rate and bonding strength, the O-2 plasma parameters and thermal bonding parameters were optimized during the bonding process. The tensile test indicates that the bonding strength of the PET planar nanofluidic chip can reach 0.954 MPa, while the auto-fluorescence test demonstrates that there is no leakage or blockage in any of the bonded micro-or nanochannels.