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Indexed by:期刊论文

Date of Publication:2013-12-01

Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Included Journals:SCIE、EI、Scopus

Volume:69

Issue:9-12

Page Number:2621-2627

ISSN No.:0268-3768

Key Words:Nanogrinding; Undeformed chip thickness; Brittle-ductile transition; CdZnTe; Surface roughness

Abstract:Nanogrinding was conducted on soft-brittle cadmium zinc telluride (CdZnTe or CZT) wafers using a ceramic bond ultrafine diamond wheel. Surface roughness R (a) and PV achieved by nanogrinding are 1.5 and 12.2 nm, respectively. The highest feed rate was 83.3 nm/r, which is lower than 89 nm that is the critical value of brittle-ductile transition for CZT. As a result, ductile grinding was obtained. A novel model for wafer rotational grinding of undeformed chip thickness was proposed, based on the kinematics and geometric characteristics between wheel and workpiece. The undeformed chip thickness simulated was used to elucidate the fundamental mechanism for nanogrinding conditions, and it is in good agreement with the results found experimentally.