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Indexed by:期刊论文

Date of Publication:2015-02-01

Journal:ACS CATALYSIS

Included Journals:SCIE、EI、Scopus、ESI高被引论文

Volume:5

Issue:2

Page Number:627-630

ISSN No.:2155-5435

Key Words:water splitting; copper; electrocatalysis; water oxidation; thin film

Abstract:A robust water oxidation catalyst based on copper oxide was prepared by facile electrodeposition of Cu2+ from borate buffer solution under near neutral conditions. The Cu-B-i thin film exhibits high activity and long-term stability in Cu2+-free pH 9 borate buffer. A steady current density of 1.2 mA/cm(2) was sustained for at least 10 h at 1.3 V versus NHE without iR compensation, which sets a new benchmark for copper-based OEC.