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一种基于冗余金属的过孔结构及电迁移修正方法

Release Time:2019-10-09  Hits:

First Author: CHEN XIAOMING

Disigner of the Invention: 张建伟,李松松,耿保林

Application Number: CN201610341770.1

Authorization Date: 2016-05-20

Authorization Number: CN105845664A

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