Hits:
First Author:Honghua Zhao
Disigner of the Invention:郭靖,赵春吉,李鹏飞,常艳
Authorization Date:2013-09-11
Authorization number:ZL201210589423.2
Pre One:一种真空/电渗/磁场/堆载联合预压加固软基的方法
Next One:岩土体变形测量软件