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一种利用真空磁场复合预压的加固软土地基的方法

Release Time:2022-10-19  Hits:

First Author: Honghua Zhao

Disigner of the Invention: 郭靖,赵春吉,李鹏飞,常艳

Institution: 运载工程与力学学部

Application Number: CN102979082A

Authorization Number: CN201210589423.2

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