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一种真空/电渗/磁场/堆载联合预压加固软基的方法

Release Time:2022-10-19  Hits:

First Author: Honghua Zhao

Disigner of the Invention: 郭靖,赵春吉,李鹏飞,常艳

Institution: 运载工程与力学学部

Application Number: 201210589409.2

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