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Senior Engineer Supervisor of Master's Candidates

Paper Publications

[11]Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763
[12]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai, XY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337
[13]刘晓英, 赵杰, 邹龙江, 季首华.材料科学基础实验课多媒体教学及网络教学平台建设[J],中国现代教育装备,2013,19:42-43
[14]Zhao, N., Liu, X. Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931
[15]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai.Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging[A],2013,400-402
[16]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate[A],2013,706-708:138-141
[17]Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaoying.Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substra...[A],2013,52(1):753-758
[18]赵宁, 黄明亮, 马海涛, 潘学民, 刘晓英.液态Sn-Cu钎料的粘滞性与润湿行为研究[J],物理学报,2013,62(8):86601-86601
[19]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi sol...[A],2012,422-424
[20]刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来, Wang, L.(wangl@dlut.edu.cn).Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2012,22(4):1169-1176

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