大连理工大学主页平台管理系统董伟--中文主页-- Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation

论文成果

Investigation on the removal of B impurity in metallurgical grade Si by electron beam melting

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发表时间：2022-10-03
发表刊物：7th International Forum on Advanced Material Science and Technology, IFAMST-7
所属单位：材料科学与工程学院
文献类型：A
卷号：675 677
页面范围：29-32
ISSN号：0255-5476

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