Hits:
Date of Publication:2024-05-17
Journal:Materials Today Communications
Volume:39
ISSN No.:2352-4928
Key Words:Al1-xscxN film; Compressive stress; Cosputtering; Ferroelectric films; Ferroelectric property; In-plane stress; Nitrogen compounds; Plane-stress state; Sc incorporation; Si substrates; Textures; Thin films; Thin-films; Wurtzite structure; X ray diffraction analysis; X- ray diffractions; Zinc sulfide