Comparative study on the influence mechanism of He/Ar/N2 plasma treatments on the high tensile stress of a multilayer silicon nitride film
Release Time:2026-03-17 Hits:
Indexed by: Journal Papers
Document Code: 478186
Date of Publication: 2025-05-29
Journal: RSC ADVANCES
Volume: 15
Issue: 23
Page Number: 17875-17884
Key Words: CHANNEL; CHEMICAL-VAPOR-DEPOSITION; ENHANCEMENT; IMPACT; RESIDUAL-STRESS; THIN-FILMS