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热流体力学对封装测试工艺的影响分析技术服务

Release Time:2019-10-22  Hits:

Leading Scientist: 周平

Project Participants: 闫英

Project Source: 国际合作项目

Status: 结题

Supported by: Intel Products (Chengdu) Co., Ltd.

Nature of Project: 横向

Date of Project Approval: 2019-08-01

Scheduled Completion Time: 2019-11-30

Date of Project Initiation: 2019-10-01

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