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热流体力学对封装测试工艺的影响分析技术服务

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Leading Scientist:周平

Project Participants:yanying

Supported by:国际合作项目

Status:结题

Supported by:英特尔产品(成都)有限公司

Nature of Project:横向

Date of Project Approval:2019-08-01

Scheduled completion time:2019-11-30

Date of Project Initiation:2019-10-01

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