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集成电路用CMP抛光垫测评方法研究

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Leading Scientist:周平

Project Participants:yanying

Supported by:企事业单位委托科技项目

Status:结题

Supported by:湖北鼎汇微电子材料有限公司

Nature of Project:横向

Date of Project Approval:2020-04-25

Scheduled completion time:2022-04-24

Date of Project Initiation:2020-04-25

Date of Project Completion:2022-11-07

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