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集成电路用CMP抛光垫测评方法研究

Release Time:2020-05-26  Hits:

Leading Scientist: 周平

Project Participants: 闫英

Project Source: 企事业单位委托科技项目

Status: 结题

Supported by: Hubei Dinghui Micro Electronic Material Co., Ltd.

Nature of Project: 横向

Date of Project Approval: 2020-04-25

Scheduled Completion Time: 2022-04-24

Date of Project Initiation: 2020-04-25

Date of Project Completion: 2022-11-07

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