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磨削减薄芯片强度测试装置设计和分析软件开发

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Leading Scientist:周平

Supported by:企事业单位委托科技项目

Status:在研

Supported by:中电智能卡有限责任公司

Nature of Project:横向

Date of Project Approval:2024-05-09

Scheduled completion time:2024-12-09

Date of Project Initiation:2024-05-09

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