Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
Release Time:2023-01-19 Hits:
Date of Publication: 2022-10-02
Journal: PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE
Institution: 运载工程与力学学部
Volume: 55
Page Number: 70-76
ISSN: 0141-6359