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Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)

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Date of Publication:2022-10-02

Journal:PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE

Affiliation of Author(s):运载工程与力学学部

Volume:55

Page Number:70-76

ISSN No.:0141-6359

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